The Taiwanese company ASRock has introduced an active cooling system for M.2 solid storage devices called Blazing M.2 Gen5 Fan-Heatsink, which is designed to be used in conjunction with the AMD X670, B650 and Intel Z790 chipnets, using the PCIe 5.0 interface to connect the storage device.
The new design is a monolithic aluminium block with sufficiently thick ribs. The design includes a 30-millimeter fan that produces an airflow of 4.92 CFM. ASRock created five different designs of a cooling system in black and silver colours, each designed for use with different parent fees.
In addition, the company has published a list of compatible motherboards of its own production and related versions of Blazing M.2 Gen5 Fan-Heatsink. The cost of the new refrigeration system has not been announced.
Active cooling systems for solid storage devices are currently rare, but are likely to change in the future. Earlier this year, Phison stated that the solid storage devices M.2 NVMe will require additional cooling when connected via PCIE 5.0. The fact is that these storage devices will offer a data transmission rate of 14 Gbit/s, which will release a significant amount of thermal energy. The temperature of the storage devices will also increase as the data is filled. In order to ensure that the storage temperatures do not exceed the critical temperature for the NAND flash drive of 80 °C, additional cooling may be required.