AMD Director General Lisa Soo, along with a number of other senior managers of the company, intends to visit Taiwan from the end of September to the beginning of November to discuss cooperation with local partners, and the AMD leadership will negotiate with TSMC, as well as chip packers and major PC manufacturers.
During the visit, Ms. Su will meet with the head of TSMC, C.C. Wei , and hand over DigiTimes with reference to her own sources.
The AMD's success in the processor market in recent years requires, among other things, the ability of TSMC to produce advanced products in large quantities. In order to sustain success, AMD needs timely access to processor design kits. TSMC will launch mass production on N2 nodes in the second half of 2025, so AMD is now in need of negotiations to introduce technology into 2026 products.
In addition to advanced semiconductor technologies, the success of AMD will also depend on packaging solutions: the company will continue to develop CPUs and GPUs of several crystals. Today, AMD is using several progressive solutions, but in the long run, the need for different packaging technologies will only grow, and there is a need for early agreement on production capacity and prices. With Unicron Technology, Nan Ya PCB and Kinsus Interconnect Technology, printing fees and substrates will be discussed. Finally, the AMD leadership will meet with ASUS and Acer, the largest Thai PC producers and long-standing partners of the company, as well as with the ASMEDia chipnet developer.