From the engineering sample Core i9-139000 the lid was removed

From the engineering sample Core i9-139000 the lid was removed

The Chinese techologist Expreview published a video removing the heat distribution lid from an engineering sample of Intel Core i9-13900. The video of the process confirmed that the increase in the number of energy-efficient Gracemont kernels in the processor significantly increased the total area of the crystal compared to the predecessor.

The area of the 10-nm engineering sample of the Core i9-139000 processor is about 257 mm2, which is about 49 mm2 more than the 10-nm Alder Lake crystal of the relevant generation. However, the Raptor Lake crystal is smaller than the 14th Rocket Lake crystal, which has an area of 280 mm2.

Dismantling the heat distribution lid is a very risky process, in which you can physically damage the crystal and the surrounding SMD components. It's not only about experience, but also about luck. Even experienced enthusiasts have killed a lot of processors in this way.

Fortunately, China's Excel has gone without any problems. The removal of the lid will eventually replace the thermointerface between the processor and the lid with a more efficient one. This may be extremely relevant in the case of very productive Intel processors, whose TDP can reach 250 W at peak load.

The 13th generation of Intel Core processors is expected on September 27 at the Intel Innovation event, and new generation chips are available for sale as early as mid-October.