MSI prepares MEG X670E Godlike flagship fee for AMD Ryzen 7000 chips with a 27-phase power subsystem

MSI prepares MEG X670E Godlike flagship fee for AMD Ryzen 7000 chips with a 27-phase power subsystem

MSI is preparing a flagship motherboard MEG X670E Godlike for future Ryzen 7000 processors. A complete picture of the new one is not yet available, but there are already pictures of the "naked" printed plate without different components, as well as the technical specifications of the new one.

The MEG X670E Godlike model is a bonus fee. It is implemented in the E-ATX form-factor and has a size of 305 x 288 mm. It is based on the Senior AMD X670E chipset, which is a set of two AMD B650 chips. In this way, it will support the PCIE 5.0 interfaces for both hard drives and video cards.

The MEG X670E Godlike received a reinforced 24+2+1 phase power subsystem.

The new one has three PCIe 5.0 x16 slots. The top default is in x16 mode. When two video cards are installed in two upper slots, they operate in x8 mode and the third in x4 mode. There are also four M2 distributions for hard NVMe accumulators: one PCIe 5.0 x4, three others are PCIe 4.0 x4. The four DDR5 DIM slots allow use of up to 128 Gbytes of the operating memory of the DDR5-55600 standard. It is not known at this time what the maximum LSA speed will be supported by a pay.

There are eight SATA ports and four USB 2.0. There are two network controllers on board. One provides a wire link speed of up to 10 Gbit/s and the other up to 2.5 Gbit/s. There are no external video interfaces MEG X670E Godlike.

It appears that the fee will also receive the M-Vision display. The system information will be posted on it. In addition, the MSI application or YouTube video will be available on the display.

According to VideoCardz, the MEG X670E Godlike is available on August 4th.