Infinix presented advanced liquid cooling technology for smartphones 3D VCC

Infinix presented advanced liquid cooling technology for smartphones 3D VCC

Infinix announced the development of an innovative liquid-cooling technology for powerful smartphones: the decision was called 3D Vapor Cloud Chamber and was based on a volatilizing chamber of a new design.

In comparison to conventional products, the system is said to increase heat diffusion efficiency by 12.5% and reduce temperature by about 3 degrees, which has a positive effect on the performance of the device. This solution reduces the throttle and prevents a drop in the frequency of personnel and the hanging of the screen while working with heavy applications.

A special form of cooling chamber has enabled Infinix engineers to achieve a 20 per cent increase in the volume of fluid and internal space used compared to the standard systems, while the projection in the cell structure allows almost direct contact with the smartphone processor, which increases the heat conductivity and heat dissipation rate.

When the temperature in the cooling chamber is increased, the liquid in the chamber is volatilised and vents excess heat. The hot vapour then enters the condenser, converts it back into liquid and, thanks to a special structure, returns it to the cooling chamber at the expense of the hot and cold air circulation system.

In the design of the system, Infinix specialists had to solve a number of difficulties, one of which was the need to ensure the strength of the design. The company's engineers designed an internal three-dimensional structure in the form of a matrix support, balancing the flatity and the size of the inner chamber.

The second major challenge was to maintain the integrity of the wick structure in a three-dimensional chamber, because an unusual shape could create folds that could potentially close the entire cooling system. The solution could be found through a comprehensive analysis of the density of the capillary structure and best welding techniques.

Experts paid particular attention to the position of the hole in the front of the body and the strength of its alloy, thus reducing the thermal resistance of the conductor environment, and the team carried out a large number of tests and tests before finding the ideal position.

As a result of intensive work on the three key features of the new technology identified above, Infinix was able to create a unique solution for the liquid cooling of the smartphone, 3D Vapour Cloud Chamber, with plans to create more finer cooling chambers with more protrusions, the use of new materials, and the integration of 3D VCC into the central smartphone frame.