Samsung lured a chip-packing expert from Apple

Samsung lured a chip-packing expert from Apple

Samsung Electronics recently lured a semiconductor expert from Apple, reports Business Korea. It is noted that Apple Kim Woo's former employee will be working on the development of microchip packaging technologies, among other things.

Kim is from South Korea, and after graduating from Korea's Institute of Advanced Technology, he worked at Texas Instruments and Qualcomm, and in 2014 he moved to Apple.

The Korean publication, with reference to industry experts, reports that this action on the part of Samsung is quite unexpected, especially given the special relationship between it and Apple companies, both producers not only cooperate but compete directly.

Chip pack technologies are one of the areas that Samsung Electronics is currently focusing on. With the increasing difficulty of developing more advanced process processes, microschemists are trying to improve microscheme packaging technologies to overcome various physical constraints in chip production.